ES Materials & Manufacturing

ES Materials & Manufacturing is a multidisciplinary peer-reviewed international research journal incorporating research activities in all experimental and theoretical aspects of materials and manufacturing. The research topics include the most exciting and significant advances in all areas of materials research and their related manufacturing process. Both fundamental and applied studies are encouraged, e.g., functional materials for energy-, optics-, and electronic-related applications, biomaterials, structural materials, advanced manufacturing, chemical/physical processes during materials synthesis or manufacturing, and computational materials science. This journal specializes in cutting-edge research with the mission of providing sustained value in the evolving world of academic and industrial fields.

Any article that focuses on, but not limited to the following field of research will be considered for its publication, upon satisfying accepted ethical and scientific publishing standards.

  1. Functional materials for energy-, optics-, and electronic-related applications.
  2. Composites
  3. Metals, alloys and their composites
  4. Ceramics and the composites
  5. Carbon and the composites
  6. Polymer and the composites
  7. Gradient structural materials
  8. Metamaterials
  9. Materials supplies and supply chain
  10. Biomedical materials and devices
  11. Building and construction materials
  12. Aerospace and transportation materials
  13. Fire retardant
  14. Artificial intelligence and machine learning
  15. Smart materials
  16. Biomaterials
  17. Structural materials
  18. Advanced manufacturing
  19. Chemical/physical processes during materials synthesis or manufacturing
  20.  Computational materials science

Article types

ES Materials & Manufacturing accepts the manuscripts in the following formats:

  1. Full Paper
  2. Communication/Letters
  3. Review Articles (Authoritative and Comprehensive)
  4. Comments
  5. Personal Account

Indexing and Archiving

ES Materials & Manufacturing is covered by the following databases and archives:

Indexing & Abstracting Services

  1. China National Knowledge Infrastructure (CNKI)
  2. Chemical Abstracts Service (CAS)
  3. Dimensions
  4. Norwegian Register for Scientific Journals, Series and Publishers(NSD)

Content Aggregators

  1. Google Scholar
  2. Semantic Scholar

 

 

 

Copyright Information

Rights and Permissions

Engineered Science Publisher Policies

© Engineered Science Publisher LLC 

Processing Time

Depending on the manuscript type and number of submissions, the average manuscript turnaround time (the average time from submission to initial decision) will be around 10 days and the submission to acceptance ranges from 6-7 weeks.

After acceptance, the citable just-accepted manuscript with doi will be online in 1 week and another 4-5 weeks to get the final corrected article online after getting the authors’ final proof. The print version will be available 2-3 weeks later after the online volume is issued.

Subscribe to this journal:

The ES Materials & Manufacturing Journal is owned and managed by Engineered Science Publisher.

ES Materials & Manufacturing is a fully Gold Premium Open Access (OA) journal. There is NO Article Processing Fee (APC). All published articles will be free for Open Access (OA). This Open Access (OA) is based on a current one-time promoted payment of $2000 per article.

To help support researchers who are unable to meet some or all of the costs associated with publishing Open Access (OA), Engineered Science Publisher operates a transparent waiver policy. (A potential 50% discount is possible for Low-to-Middle income countries based on the corresponding author's listed affiliation with a justified request; the fee can be covered by the publisher upon approval).

Please feel free to recommend this journal to your Librarian, please visit this link for the recommendation.

https://www.espublisher.com/recomendtolibrarian

For information on subscription rates please contact Engineered Science Publisher Customer Service Center: [email protected]

Subscribe

The ES Materials & Manufacturing Journal is owned and managed by Engineered Science Publisher.

ES Materials & Manufacturing is a fully Gold Premium Open Access (OA) journal. There is NO Article Processing Fee (APC). All published articles will be free for Open Access (OA). This Open Access (OA) is based on a current one-time promoted payment of $2000 per article.

To help support researchers who are unable to meet some or all of the costs associated with publishing Open Access (OA), Engineered Science Publisher operates a transparent waiver policy. (A potential 50% discount is possible for Low-to-Middle income countries based on the corresponding author's listed affiliation with a justified request; the fee can be covered by the publisher upon approval).

Please feel free to recommend this journal to your Librarian, please visit this link for the recommendation.

https://www.espublisher.com/recomendtolibrarian

For information on subscription rates please contact Engineered Science Publisher Customer Service Center: [email protected]

Subscribe

News and Announcements:

News

Call for papers

Special issue on: Thin Film Materials and Devices Call for papers Thin Film Materials and Devices is a special issue of ES Materials & Manufacturing for reporting ...

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News

Annual Best Paper Award for ES Materials & Manufacturing

Annual Best Paper Award for ES Materials & Manufacturing To recognize the significant contribution to the development of ES Materials & Manufacturing journal, the&...

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Best of 2018

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  5. Mechanical and Conductive Properties of Smart Cementitious Composites with Conductive Rubber Crumbs

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Editor-in-Chief

Qing Hao, University of Arizona, USA

Research Area: Nanoscale energy transport and its applications in advanced materials and nano-electronic devices, heat transport inside Li-ion batteries, high-power electronics, boiling and condensation, thermal insulation materials, thermo electrics, measurements and engineering applications of graphene and other two-dimensional materials.

Ying Li, Texas A&M University, USA

Research Area: Fuels from Sunlight, CO2 Capture and Catalytic Conversion, Energy Storage Devices , Nanomaterials Synthesis and Characterization, Water Treatment and Desalination, Air Pollution Control, Aerosol Science and Technology, Engineering Education (Web-Based Educational Modules).

Na (Luna) Lu, Purdue University, USA

Research Area: High-Temperature Energy Harvesting in Wide Bandgap Semiconductor, Investigating process structure relations of ZnO nanofiber via electrospinning process for piezoelectricity, The Current Status and Future Prospect For High Temperature Thermoelectric Materials, Nano-structuring Low Dimensional Thermoelectric Composites for High Temperature Applications, Wide Bandgap Materials for Thermoelectric Energy Applications.

Yijun Shi, Luleå University of Technology, Sweden

Research Area: Triboelectric Nanogenerators, Advanced Lubrication, Bio-oil, Ionic Liquid/Glycerol Aqueous Solution, Photo-healing of ion gels and photo-controlled reversible adhesiveness, Friction, and wear of polymer nanocomposites.

Executive Editors

Subramania Angaiah, Pondicherry University, India

Ai Du, Tongji University, China

Hongbo Gu, Tongji University, China

Qinyu HeSouth China Normal University, China

Jing LinGuangZhou University, China

Yuanbing Mao, Illinois Institute of Technology, USA

Bo Jiang, Harbin Institute of Technology, China

Qinglong Jiang, University of Arkansas at Pine Bluff, USA

Habib M. Pathan, Savitribai Phule Pune University, India

Luyi Sun, University of  Connecticut, USA

Ahmad UmarNajran University, Najran, Kingdom of Saudi Arabia

Jinshu Wang, Beijing University of Technology, China

Hongbo ZengUniversity of Alberta, Canada.

 

 

 

Editorial Board

Zhiqiang Liu, Chinese Academy of Science, China

Paolo Mele, Shibaura Institute of Technology, Japan

Caiyun Wang, University of Wollongong, Australia

Zhe Wang, Oakland University Chemistry department

Jinglei Yang, Hong Kong University of Science & Technology, China

Nuo Yang, Huazhong University of Science and Technology, China

Dazhi Sun, Southern University of Science and Technology, China

Advisory Board

Rakesh Agrawal, Purdue University, USA

Cewen Nan, Tsinghua University, China

Surendra Shah, Northwestern University, USA

Associate Editors

Ke Bi, Beijing University of Posts and Telecommunications, China

Xin Cheng, University of Jinan, China

Henry A. Colorado, Universidad de Antioquia, Colombia

Nelson Y. Dzade, Cardiff University, United Kingdom

Shien-Ping Feng, Hong Kong University, China

Min Gao, Cardiff University, UK

Lilin He, Oak Ridge National Laboratory, USA

Pengkun Hou, University of Jinan, China

Baoling Huang, The Hong Kong University of Science and Technology, China

Sandesh R. Jadkar, Savitribai Phule Pune University, India

Bo Li, Villanova University, Pennsylvania, USA

Qinyi Li, Kyushu University, Japan

Wengui Li, University of Technology Sydney, Australia

Guang Lin, Purdue University, USA

Xianhu Liu, Zhengzhou University, China

Hongyan Ma, Missouri University of Science & Technology, USA

Edoardo Magnone, Dongguk University, South Korea

Nithesh Naik, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal, India

Ilwoo SeokArkansas State University, USA

Jingyao SunBeijing University of Chemical Technology, USA

Yijun Shi, Luleå University of Technology, Sweden

Tyler Tallman, Purdue University, USA

Liping Wang, Arizona State University, USA

Even K. Wujcik, University of Alabama, USA

Yongzheng WenTsinghua University, China 

Guang Yang, Huazhong University of Science and Technology, China

Jingfang YuUniversity of Oxford, United Kingdom

Mona Zebarjadi, University of Virginia, USA

Yanliang Zhang, University of Notre Dame, USA

 

 

For Futher information, Please Contact

Dr. Vignesh Murugadoss,
Journal Coordinator,
Engineered Science Publisher LLC,
Gwinhurst Road Knoxville, TN 37934 USA

Email: [email protected]       

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