We describe the growth of patterned cobalt onto a mechanically scratched copper substrate. The deposition of patterned cobalt thin-films was carried out by electrodeposition from a sulphate bath at room temperature. A uniform copper surface was mechanically polished with a fine polishing paper to form periodic ditches on the substrate. This pre-patterned substrate has been utilized for the electrochemical deposition of the patterned Cobalt Thin Films. It is apparent from XRD analysis that the style of the surface pattern of a substrate influences the deposits. The results presented here provide a natural and alternative view for the engineering of patterned arrays of cobalt.