Hierarchical Assembly of CuO Nano-Dandelions on 3-D Printed Template

Md Didarul Islam 1

Hamad Al Yassi 2

Mengyao Dong 3

Daniel S. Choi 2

Ilwoo Seok 4

Chuntai Liu 5

Zhanhu Guo 3

Jong Eun Ryu 1, Email

1 Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695, USA

2 Department of Mechanical Engineering, Khalifa University of Science and Technology, Abu Dhabi, United Arab Emirates

3 Department of Chemical and Biomolecular Engineering University of Tennessee, Knoxville, TN 37996, USA

4 Department of Mechanical Engineering, Arkansas State University, Jonesboro, AR 72401, USA

5 Key Laboratory of Materials Processing and Mold, Ministry of Education; National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, Zhengzhou, 450002, China


We report a two-phase chemical synthesis of various copper (Cu) nanostructures throughout complex 3-dimensional (3-D) printed substrates. We present dandelion-like CuO nano-rods grown on a 3-D model. 1 mm x 1 mm x 10 mm bars are cross-stacked to form a cubic log-pile structure. Ni thin-film was electrolessly deposited, and subsequently Cu layer was electroplated on the 3-D log-pile structure. In order to grow nanostructures, the Cu layer was reacted with an alkali solution (NH4OH). The surface morphology and chemistry were characterized by field 4 emission scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX).

Hierarchical Assembly of CuO Nano-Dandelions on 3-D Printed Template