Advanced Thermal Interface Materials for Thermal Management

Wei Yu 1, Email

Changqing Liu 2

Lin Qiu 3

Ping Zhang 4

Weigang Ma 5

Yanan Yue 6

Huaqing Xie 1

LeighAnn Sarah Larkin 7

1 College of Engineering, Shanghai Polytechnic University, Shanghai, 201209, China

2 School of Mechanical and Energy Engineering, Shaoyang University, Shaoyang 422001, Hunan, China

3 School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China

4 School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

5 Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

6 School of Power and Mechanical Engineering, Wuhan University, Wuhan, Hubei 430072, China

7 Department of Mechanical and Aerospace Engineering, University of Virginia, 122 Engineer's Way, Charlottesville, VA 22904-4746, USA


Suitable temperature is a necessary condition for the normal operation of many devices, especially microelectronic devices. Therefore, heat dissipation has become a bottleneck in many fields. Furthermore, the largest thermal resistance in the process of heat transfer occurs between two solid surfaces due to the poor thermal conductivity of air that exists in the gaps. Replacing air with thermal interface materials (TIMs) is the fundamental way to solve the problem of heat dissipation. Consequently, TIMs are widely used in LED lighting, solar energy, microelectronics, electrical and electrical engineering, aerospace, defense and other fields.

Advanced Thermal Interface Materials for Thermal Management