Suitable temperature is a necessary condition for the normal operation of many devices, especially microelectronic devices. Therefore, heat dissipation has become a bottleneck in many fields. Furthermore, the largest thermal resistance in the process of heat transfer occurs between two solid surfaces due to the poor thermal conductivity of air that exists in the gaps. Replacing air with thermal interface materials (TIMs) is the fundamental way to solve the problem of heat dissipation. Consequently, TIMs are widely used in LED lighting, solar energy, microelectronics, electrical and electrical engineering, aerospace, defense and other fields.