Recent Advances in Thermal Interface Materials
Yongcun Zhou, Siqi Wu, Yuheng Long, Pengli Zhu, Feixiang Wu, Feng Liu, Vignesh Murugadoss, Williams Winchester, Amit Nautiyal, Zhe Wang and Zhanhu Guo
1 School of Material Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China
2 Yangtze River Delta Research Institute of Northwestern Polytechnical University, Taicang 215400, China
3 Queen Mary University of London Engineering School, Northwestern Polytechnical University, Xi’an 710072, China
4 Shenzhen Institute of Advanced Electronic Materials, Shenzhen Fundamental Research Institutions, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
5 School of Metallurgy and Environment, Central South University, Changsha 410083, China
6 Analytical & Testing Center, Northwestern Polytechnical University, Xi’an 710072, China
7 Electro-Materials Research Laboratory, Centre for Nanoscience and Technology, Pondicherry University, Puducherry 605014, India
8 Integrated Composites Laboratory (ICL), Department of Chemical and Biomolecular Engineering, University of Tennessee, Knoxville, TN 37996, USA
9 Chemistry Department, Xavier University of Louisiana, New Orleans 70125, USA
Abstract
In recent years, miniaturization and integration have become the development trends of electronic devices. With the power of electronic devices continuing to increase, the amount of heat generated is sharply increasing. Thermal interface material (TIM) can effectively improve heat transfer between two solid interfaces, and it plays an important role in the performance, service life and stability of electronic devices. In this case, higher requirements are put forward for thermal management, so much attention is also attached to the innovation and optimization of TIM. In this paper, recent research development of TIM is reviewed. Rheology-based modeling and design are discussed for the widely used polymeric TIMs. It is discussed for the effects of thermal conductive fillers on the properties of composites. Many studies have shown that some polymers filled with high thermal conductivity and low loss ceramics are well suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been paid to the preparation of polymeric composites with high thermal conductivity for the application in electronic packaging. Finally, the problems are also discussed and the research directions of TIM in the future are prospected.
Publication details
Received: 15 Feb 2020
Revised: 29 Feb 2020
Accepted: 05 Mar 2020
Published online: 08 Mar 2020
Article type:
Review Paper
DOI:
10.30919/esmm5f717
Volume:
7
Page:
4-24
Citation:
ES Materials & Manufacturing, 2020, 7, 4-24
Permissions:
Copyright
Number of downloads:
2452
Citation Information:
16
Description:
In this paper, the recent research development of thermal interface materials is reviewed, including....
In this paper, the recent research development of thermal interface materials is reviewed, including modeling, fillers and thermal conductive network.
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