Simulation for the Influence of Interface Thickness on the Dendritic Growth of Nickel- Copper Alloy by a Phase-Field Method
Abstract
Based on the WBM II (Wheeler-Boettinger-McFadden) phase-field model, the solute concentration at the solid-liquid interface region was defined and analyzed to make it more consistent with actual solidification conditions. The interface thickness in the model was modified, and on this basis, the dendritic morphology and solute distribution during the growth of Ni-Cu alloy dendrite were simulated. The results show that with the interface thickness decreases, the secondary dendrite arms become more developed and the dendrite trunks become finer. The smaller the interface thickness, the thinner the solute diffusion layer at the solid-liquid interface frontier, and the solute at the frontier more easily diffuses into the adjacent liquid phase, thus the dendrite tip grows faster.
