Call for papers

  Released on December 23, 2020            Jing Yang

Special issue on: Electronic Materials for Sensor Applications

Call for Papers

Sensors are becoming increasingly important in various fields such as home life, industries, recreation and medical applications. The ongoing research in the area of sensor materials and related technology will help the scientist and engineers in developing the next generation of electronic materials for sensor applications. The research and development on this fascinating topic require interdisciplinary approach which combines electronic materials, nanotechnology, fabrication techniques, modelling and simulations and device engineering. Hence there is possibility to manufacture new sensors with advanced properties such as sensitivity, selectivity, lower cost with increased stability and reliability by tailoring material properties. This special Issue wants to strengthen this interdisciplinary approach by combining the original contributions related to basic and advanced research on electronic materials development on sensing technology for emerging applications.

The Issue would include the following topics:

Functional materials: electronic, optical, magnetic, semiconducting etc
Sensing method and technologies
Gas sensor
Humidity sensor
Electrochemical sensor
Acoustic sensor
Sensor Fabrication technologies
Modelling and simulations for sensors design
All submissions will be peer-reviewed. Peer review will commence immediately upon manuscript submission, with a goal of making the first decision within four weeks of manuscript receipt. Manuscripts should be submitted through the Manuscript Tracking System at:

Submission Deadline: 30th June 2021

Guest Editors:

Dr. Insik In, Korea National University of Transportation, South Korea.     

E-mail: [email protected]

Dr. Shweta Jagtap, Savitribai Phule Pune University, Pune-07, India.     

E-mail: [email protected]

Dr. Georgi Dobrikov, Technical University of Sofia, Sofia, Bulgaria  

E-mail: [email protected]

Dr. T. M. W. J. Bandara, University of Peradeniya, Sri Lanka      

E-mail: [email protected]


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